Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration

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Johann Knechtel, Ozgur Sinanoglu, Ibrahim Abe M. Elfadel, Jens Lienig, Cliff C. N. Sze

Published: 2017, Last Modified: 10 Jun 2024IPSJ Trans. Syst. LSI Des. Methodol. 2017EveryoneRevisionsBibTeXCC BY-SA 4.0