Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules

Published: 01 Jan 2014, Last Modified: 15 May 2025Microelectron. Reliab. 2014EveryoneRevisionsBibTeXCC BY-SA 4.0
Abstract: Highlights•A reduced-order thermal model coupled with physics-of-failure-based life models.•Study of effects of power and thermal cycling on two main failure mechanisms.•Identify the dominant wear-out mechanism with minimum elapsed time.•Appropriate reliability assessment to predict lifetime under in-service conditions.•Important method for design and qualification tests of power electronic modules.
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