A novel approach for wafer defect pattern classification based on topological data analysis

Seungchan Ko, Dowan Koo

Abstract: Highlights•A novel approach for wafer map defect pattern classification is proposed.•This new method is based on the theory from topological data analysis.•The proposed method is accurate and computationally efficient.•This algorithm is fast enough to provide a real-ti me prediction.•This method is robust against a small and imbalanced dataset.