O.O: Optimized one-die placement for face-to-face bonded 3D ICs

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Xingyu Tong, Yuhao Ren, Zhijie Cai, Peng Zou, Min Wei, Yuan Wen, Zhifeng Lin, Jianli Chen

Published: 01 Jan 2025, Last Modified: 13 May 2025Integr. 2025EveryoneRevisionsBibTeXCC BY-SA 4.0
Abstract: Highlights•Focuses on placement in F2F 3D ICs with heterogeneous technology and hybrid bonding.•Challenges include coordinating partitioning and placement in F2F 3D ICs.•Extends one-die placement with sequential pre-placement, multi-level partitioning, and placement.•Achieves competitive runtime and top wirelength results in the 2022 ICCAD CAD Contest.