An Intelligent 3D Printing Path Planning Algorithm 3D Printing Path Planning Algorithm: An Intelligent Sub-Path Planning Algorithm

Huishu Yin, Shengfa Wang, Yi Wang, Fengqi Li, Linlin Tian, Xinwei Xue, Qi Jia

Abstract: The path planning of large industrial parts in additive manufacturing directly affects manufacturing quality and efficiency. At present, the commonly used traditional path planning methods have many problems, such as turning and stacking of print head and the number of rise and fall of the print head, so they are not suitable for large industrial parts. Therefore, an intelligent path planning algorithm is proposed. Firstly, the two-dimensional plane obtained after slicing is concavely convexly decomposed into printing sub-areas, and then the sub-partition connection is treated as a traveling salesman problem (TSP) to reduce the number and length of printing paths. By comparing with traditional path planning algorithms, the proposed method significantly reduced the number of paths, the idle travel distance, and the number of print head lifts. The sub-partition-based intelligent path planning method provides a new idea for the additive manufacturing process of large industrial parts.