Thermal-aware processing-in-memory instruction offloading

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Lifeng Nai, Ramyad Hadidi, He Xiao, Hyojong Kim, Jaewoong Sim, Hyesoon Kim

Published: 2019, Last Modified: 09 May 2025J. Parallel Distributed Comput. 2019EveryoneRevisionsBibTeXCC BY-SA 4.0
Abstract: Highlights•We provide a thermal analysis to understand the thermal constraints of a real-world 3D memory.•Our thermal analysis shows that DRAM layers can exceed the normal operating temperature when PIM offloading is used.•We propose a collection of thermal-aware source throttling techniques that dynamically controls the intensity of PIM offloading.