Mixed-Type Wafer Failure Pattern Recognition

Hao Geng, Qi Sun, Tinghuan Chen, Qi Xu, Tsung-Yi Ho, Bei Yu

Abstract: The ongoing evolution in process fabrication enables us to step below the 5nm technology node. Although foundries can pattern and etch smaller but more complex circuits on silicon wafers, a multitude of challenges persist. For example, defects on the surface of wafers are inevitable during manufacturing. To increase the yield rate and reduce time-to-market, it is vital to recognize these failures and identify the failure mechanisms of these defects. Recently, applying machine learning-powered methods to combat single defect pattern classification has made significant progress. However, as the processes become increasingly complicated, various single-type defect patterns may emerge and be coupled on a wafer and thus shape a mixed-type pattern. In this paper, we will survey the recent pace of progress on advanced methodologies for wafer failure pattern recognition, especially for mixed-type one. We sincerely hope this literature review can highlight the future directions and promote the advancement of the wafer failure pattern recognition.