An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method

Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey

Abstract: Highlights•Ribbon bonding for power semiconductor devices have been simulated using FEM•Thermal-mechanical reliability improved by 10% and temperature reduced by 5% by using 1 ribbon bond to replace 3 wire bonds•The thermal mechanical failure location for ribbon bonds is predicted to be at the bonding interface.•A trade-off relationship for reducing ribbon temperature and increasing thermal mechanical reliability has been obtained.