AIG-CIM: A Scalable Chiplet Module with Tri-Gear Heterogeneous Compute-in-Memory for Diffusion Acceleration

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Yiqi Jing, Meng Wu, Jiaqi Zhou, Yiyang Sun, Yufei Ma, Ru Huang, Tianyu Jia, Le Ye

Published: 01 Jan 2024, Last Modified: 13 May 2025DAC 2024EveryoneRevisionsBibTeXCC BY-SA 4.0