Guest Editorial 2.5D/3D Chiplet Circuits and Systems, EDA, Advanced Packaging, and Test - Part I

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Qinfen Hao, Kuan-Neng Chen, Sandeep Kumar Goel, Hai Li, Erik Jan Marinissen

Published: 2025, Last Modified: 16 Jan 2026IEEE J. Emerg. Sel. Topics Circuits Syst. 2025EveryoneRevisionsBibTeXCC BY-SA 4.0