H3D: Heterogeneous Resources Aware Global Router for Face-to-Face Bonded 3D ICs

Yuxuan Zhao, Feng Gu, Siting Liu, Peiyu Liao, Bei Yu

Abstract: The emerging 3D ICs have brought challenges to traditional routers in deciding the intra-die and inter-die interconnects. Existing pseudo-3D flows rely on 2D IC routing engines, combined with a 3D via legalization step to complete routing. The separation of intra-die and inter-die routing significantly degrades solution quality. To address this issue, we propose H3D, the first native 3D global router designed for face-to-face bonded 3D ICs. H3D constructs a heterogeneous routing grid to represent routing and hybrid bonding terminal (HBT) resources. We develop dedicated dynamic programming-based algorithms to optimize the HBT number and locations for 3D Steiner trees on the heterogeneous grid. Specifically, H3D minimizes the number of HBTs by traversing the Steiner tree in reverse depth-first order and relocates HBTs to legal locations with minimal wirelength in reverse breadth-first order, leveraging the convexity of L1 distance for efficient optimization. Experimental results on various real-world designs demonstrate that H3D achieves 12% shorter wirelength, 25% fewer HBTs, and 1.9× speedup compared to state-of-the-art approaches.

External IDs:dblp:conf/iccad/ZhaoGLLY25