Three-dimensional switchbox multiplexing in emerging 3D-FPGAs to reduce chip footprint and improve TSV usage

Marzieh Morshedzadeh, Ali Jahanian, Payam Pourashraf

Abstract: Highlights•Number of required TSVs is reduced by more than 71% on average.•Area of large TSVs is reduced and unused TSVs can be used for temperature management.•Total wirelength overhead is less than 5%.•Switch overhead is reasonable.