Three-dimensional switchbox multiplexing in emerging 3D-FPGAs to reduce chip footprint and improve TSV usage

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Marzieh Morshedzadeh, Ali Jahanian, Payam Pourashraf

Published: 2015, Last Modified: 21 Aug 2025Integr. 2015EveryoneRevisionsBibTeXCC BY-SA 4.0
Abstract: Highlights•Number of required TSVs is reduced by more than 71% on average.•Area of large TSVs is reduced and unused TSVs can be used for temperature management.•Total wirelength overhead is less than 5%.•Switch overhead is reasonable.