A QDI Interconnect for 3D Systems Using Industry Standard EDA and Cell Libraries

Matheus Trevisan Moreira, William Koven, Tony F. Wu, Huseyin Ekin Sumbul, Edith Beigné

Abstract: 3D systems offer several advantages to embedded and artificial intelligence (AI) applications. In such systems, designers are not restricted to a planar monolithic die, but can rather place intellectual property (IP) blocks on different dies that can be stacked. This allows for systems where communicating IPs can be placed closer to each other, optimizing die size, which can translate to performance, power, area and form factor improvements. Among the different technologies available to build 3D systems, hybrid bonding (HB) stands out as a promising solution by enabling high density and high performance interconnects [1], [2].