Product Health Insights Using Telemetry

Fei Su, Robert Kwasnick, John Holm, William Penner, Hermann Gartler, Josh Boelter, Yufei Zhou, Bijan Arbab, Michael Rothberg

Abstract: Editor’s notes: This article explores the use of a chip telemetry infrastructure for continuous monitoring of the health of the hardware system throughout its entire lifetime. This is further extended to provide insights to check bugs in the system. — Mehdi B. Tahoori, Karlsruhe Institute of Technology, Germany